The Selectiva is a new selective soldering machine for Through-Hole components based on the Spark 100 platform.

It uses a powerful laser and a soldering wire to solder component leads from the bottom side.

The machine is available in two configurations:

1. Low end (offline) machine - Selectiva Xs.

2. High end (inline) machine - Selectiva Xi.

 

1. New CAD creator - creates fast and automatic CAD files directly from the board using machine vision technique. Saves valuable machine time.

2. Warpage compensation – compensate for warpage and board bent up to 2 mm in the center.

3. Built in AOI Inspection module – detects skipped joints, insufficient solder, and bridging.

4. Internal and External bottom and top Heaters.